VANTIVA UNVEILS 50G PON DEVICE FOR ULTRA-HIGH-SPEED FIBRE NETWORKS

 

KUALA LUMPUR, Oct 13 (Bernama) -- Vantiva, a global technology leader in connected home solutions, has unveiled a 50-gigabit passive optical network (50G PON) optical network terminal (ONT) designed to support higher-capacity fibre broadband networks and future data demands.

The FXA701Z device complies with the ITU-T G.9804 standard and supports symmetrical upstream and downstream transmission, enabling equal data transmission speeds in both directions.

It also features an XGS-PON port, allowing telecommunications operators to deploy the device on existing 10G networks before upgrading customers to 50G services without replacing the terminal, according to the company in a statement.

Vantiva Senior Director of Product Management, Barry Weber said growing data traffic from video calls, cloud backups and AI applications was increasing demand for upstream network capacity.

Meanwhile, its Chief Product and Engineering Officer Ashwani Saigal said the device would extend the company's fibre broadband product portfolio as operators prepare for the next generation of network capacity.

Vantiva said the device is designed to support bandwidth-intensive applications, including 8K video streaming, augmented and virtual reality (AR/VR), distributed artificial intelligence (AI) workloads and mobile backhaul for base stations.

The FXA701Z includes operations, administration and maintenance interface support through the optical network terminal management and control interface (OMCI), enabling operators to manage and diagnose the device using standard tools already deployed across their passive optical network infrastructure.

The device has a compact design for tabletop or wall-mounted installation, while its top and bottom covers use post-consumer recycled acrylonitrile butadiene styrene (PCR ABS) plastic.

Vantiva is showcasing the FXA701Z at Network X in Vienna, Austria, from Oct 13 to 15.

-- BERNAMA

DIC Expands Low-Solvent ECOVART Ink Rollout to Asia

KUALA LUMPUR, Oct 12 (Bernama) -- DIC Corporation will begin the global rollout of its ECOVART gravure ink, which requires significantly less solvent than conventional gravure inks, focusing on Japan, the People’s Republic of China (PRC) and Southeast Asia.

In a statement, DIC said the low-solvent ink reduces the volume of naphtha-derived solvents used by packaging materials printing companies, helping mitigate procurement risks while improving printing productivity and lowering volatile organic compound (VOC) emissions.

Packaging materials printing companies face growing pressure to reduce VOC emissions and environmental impact while securing stable supplies of raw materials and managing solvent procurement costs.

ECOVART will be showcased at DIC’s booth at the Tokyo International Packaging Exhibition 2026 (TOKYO PACK 2026). Following its introduction in Japan, the company plans to expand sales in the PRC, where solvent-use restrictions are stringent, and Southeast Asia, which is expected to see continued market growth.

Launched in India in 2022, ECOVART has recorded steady sales growth. DIC plans to draw on its experience in the Indian market to support the global rollout, beginning with Japan and targeting the PRC and Southeast Asia.

Supplied as a press-ready ink, ECOVART is preadjusted to the appropriate viscosity for printing, reducing the need for solvent dilution and viscosity adjustments required with conventional gravure inks. This shortens processing time, eases operator workloads and reduces solvent purchases, while simplifying inventory management and limiting exposure to price fluctuations.

DIC testing has confirmed that ECOVART can reduce solvent use by at least 50 per cent. The ink helps customers meet environmental targets and is suitable for solvent recovery, potentially further reducing the environmental impact of printing processes.

ECOVART also has a higher colour density than conventional gravure inks, allowing printers to achieve the required density with less ink while maintaining print quality.

Looking ahead, DIC said it would continue expanding sales globally to reduce solvent use and VOC emissions, improve productivity and support a more sustainable packaging printing industry and circular economy.

-- BERNAMA

GOING ASSET MANAGEMENT RECOGNISED FOR FINANCIAL TECHNOLOGY INNOVATION

KUALA LUMPUR, Oct 12 (Bernama) -- Going International Asset Management Limited has received the Capital Excellence Fund Award at the Capital Merits of Achievement in Banking and Finance 2026 for its financial technology innovation, quantitative investment research and development capabilities, and fund performance.

According to a statement, the award recognises Going Asset’s strengths in asset management and its technology-driven approach, following the announcement of the winners by financial publication Capital Magazine on Sept 29.

The awards recognise financial institutions that have contributed to the development of Hong Kong’s financial sector. Winners are selected based on criteria including overall performance, service quality and reputation.

Now in their 17th consecutive edition, the awards have also recognised institutions such as BOC-Prudential Asset Management, CCB International, Dah Sing Bank, Hang Seng Investment Management Limited and Nanyang Commercial Bank.

Going Asset Management uses artificial intelligence (AI)-driven high-performance computing and ultra-low-latency systems to identify cross-market price movements within microseconds. The approach aims to accumulate small gains across a large volume of trades and improve asset allocation efficiency across market cycles.

The firm’s assets under management have exceeded US$3.3 billion. According to Morgan Hedge rankings as of Aug 31, 2026, its Going Algo SP 2-Class M Fund recorded returns of 89.44 per cent over one year and 280.64 per cent over three years, ranking first globally in both periods. (US$1 = RM4.08)

The company has also expanded its use of AI, with large models processing real-time information streams and improving through reinforcement learning to support investment research and trading strategies.

Going Asset Management plans to continue prioritising AI and risk management while expanding its quantitative research and development across global markets, leveraging Hong Kong’s role as a link between international capital markets.

The firm aims to provide global investors with more resilient portfolios and asset allocation solutions through stronger strategies, greater operational transparency and higher compliance standards.

-- BERNAMA

Digital Science appoints Charlesworth as strategic sales partner of Altmetric and Dimensions in China’s scholarly publishing sector

London, UK, Oct.6, 2026 / Agility-AsiaNet/--

Digital Science has appointed Charlesworth as its strategic sales partner of Altmetric and Dimensions in China’s scholarly publishing sector. This collaboration aims to support the growing demand for research data and information across this rapidly developing market.

China’s local publishing industry has grown significantly in scale and maturity, with journal publishers actively strengthening their international position, investing in publishing capability and seeking greater insight into the reach and impact of research.

The partnership brings together Digital Science’s research technology and data solutions with Charlesworth’s extensive knowledge of the Chinese publishing market and established relationships across publishing clusters, publishers and journals.

Dimensions is one of the world’s largest connected research databases, with 430M+ interconnected records – including publications, conference abstracts, grants, patents, clinical trials and more – enabling users to discover and analyze the global research landscape.

Altmetric tracks and analyzes engagement with research as it is shared, mentioned, reviewed and read online, providing insight into the attention surrounding research beyond traditional citations.

Together, the products can support the continued development of Chinese publishers by providing greater access to research information and a broader understanding of the reach and attention generated by published research.

Michael Evans , CEO of Charlesworth, said:

“Chinese scholarly publishing has developed significantly over recent years. We are seeing increasingly ambitious publishers, publishing clusters and journals looking to build their capabilities, strengthen their international presence and better understand their position within the global research landscape.

“Charlesworth has worked with Chinese publishers for many years, giving us a strong understanding of both the market and its changing needs. Altmetric and Dimensions are highly relevant to this next stage of growth, and we are delighted to be working with Digital Science to make these products more accessible to publishers across China.”

Stephen Leicht , CEO of Digital Science said:

“China is an important and rapidly developing part of the global research ecosystem. As its publishing sector continues to grow and mature, access to high-quality research data and insights can play an important role in supporting that development. Charlesworth’s knowledge of the local market and relationships across the publishing community make them an excellent partner for Digital Science in China.”

The agreement builds on Charlesworth’s long-standing work with the Chinese scholarly publishing community and its role in connecting publishing clusters, publishers and journals with international publishing expertise, technology and services.

About Charlesworth

Charlesworth, part of Enago, works with publishers and the wider research community in China and internationally, providing sales, marketing, technology and author services to support the development and internationalisation of scholarly publishing.

About Digital Science

Digital Science is an AI-focused technology company providing innovative solutions to complex challenges faced by researchers, universities, governments, funders, industry and publishers. We work in partnership to advance global research for the benefit of society. Through our brands – Altmetric, Dimensions, Figshare, IFI CLAIMS Patent Services, metaphacts, Overleaf, ReadCube, Symplectic, and Writefull – we believe when we solve problems together, we drive progress for all. Visit digital-science.com and follow Digital Science on Bluesky , on X or on LinkedIn .

Media Contact

David Ellis , Press, PR & Social Manager, Digital Science: d.ellis@digital-science.com 

SOURCE: Digital Science

--BERNAMA 

Streamex CEO Henry McPhie to Embark on Asia Tour with Events in Singapore and Hong Kong

 

Meetings with Potential Partners and Investors Planned for Streamex Corp. and GLDY


WINTER PARK, Fla., Oct 2 (Bernama-GLOBE NEWSWIRE) -- Streamex Corp. (“Streamex” or the “Company”) (NASDAQ: STEX), a technology company building the future of the commodity markets through tokenization, today announced that Henry McPhie, Co-Founder and Chief Executive Officer, will travel to Asia in October to attend multiple events in Singapore and Hong Kong. During the tour, Mr. McPhie will meet with potential partners and investors for Streamex and for GLDY, the Company’s gold-backed yield-bearing tokenized security.

The Asia tour reflects Streamex’s continued focus on building relationships with institutional investors, strategic partners and market participants across one of the world’s most active regions for digital assets and commodities trading. At the World Family Office Forum | Asia in Hong Kong, Mr. McPhie will participate on a panel and in 1:1 investor meetings to discuss Streamex, the Company’s roadmap and the growing opportunity for GLDY.

Henry McPhie, Co-Founder and Chief Executive Officer of Streamex, stated:

“Asian investors have been among the most forward-looking participants in digital assets and real-world asset tokenization, and their influence on how these markets develop continues to grow. We look forward to meeting with potential investors and partners across Singapore and Hong Kong to share our vision for bringing commodities on-chain.”

Singapore Events

Digital Asset Summit Asia 2026, October 7, 2026, Marina Bay Sands, Singapore. Mr. McPhie will attend Blockworks’ institutional digital asset conference, meeting with institutions and prospective partners.

Token2049 in Singapore, October 7–8, 2026. Mr. McPhie will attend Token2049, a leading digital asset industry gathering in Asia, meeting with prospective partners and investors.

Hong Kong Events

World Family Office Forum | Asia, October 15–16, 2026, The Ritz-Carlton, Hong Kong. Mr. McPhie will speak on the panel “Digital Assets & Blockchain: The Next Chapter of Innovation” on October 15 from 4:00 to 4:40 p.m. HKT. The panel will be moderated by Gabriel Karageorgiou of XBTO and includes Zann Kwan of Revo Digital Family Office and Leo Chiu of Click Ventures. The seventh edition of this forum convenes Asia’s leading business families, single family offices and their trusted advisors, and Mr. McPhie expects to meet with family offices and prospective investors for Streamex and GLDY.

How to Schedule a Meeting

Attendance at the forum is by invitation only. Qualified family offices and other interested parties may request an invitation at asia.worldfamilyofficeforum.com or contact the organizer, Connect Group, at info@connectgroup.global.

To arrange a meeting with the Streamex team while Mr. McPhie is in Singapore or Hong Kong, contact Streamex Investor Relations at IR@streamex.com.

About Streamex Corp.

Streamex Corp. (NASDAQ: STEX) is a technology and infrastructure company focused on the tokenization and digitalization of commodity real-world assets. Streamex delivers institutional-grade solutions that bridge traditional finance and blockchain-enabled markets through secure, regulated and yield-bearing financial instruments.

For more information, visit www.streamex.com.

Forward-Looking Statements

This press release contains forward-looking statements within the meaning of the safe harbor provisions of the Private Securities Litigation Reform Act of 1995, Section 27A of the Securities Act of 1933, as amended, and Section 21E of the Securities Exchange Act of 1934, as amended, including statements regarding Streamex’s business strategy, investor relations initiatives, Mr. McPhie’s planned participation in events and anticipated meetings with potential investors and partners in Asia and any resulting partnerships or investments, the market opportunity for GLDY, the development and scalability of its tokenization platform, and expectations for the tokenization of real-world assets. Such statements are often identified by words such as “will,” “expects,” “plans,” “anticipates,” “intends” and similar expressions. They are based on management’s current expectations and are subject to risks and uncertainties that could cause actual results to differ materially, including that planned events or meetings may be changed, rescheduled or canceled, that meetings may not result in any partnership, investment or other transaction, and risks related to market conditions, regulatory developments affecting tokenized securities and digital assets, and the Company’s ability to develop and scale its platform and products. Forward-looking statements speak only as of the date of this press release. Except as required by law, Streamex undertakes no obligation to update any forward-looking statement. Additional information regarding these and other risks is contained in the “Risk Factors” section of the Company’s most recent Annual Report on Form 10-K and subsequent Quarterly Reports on Form 10-Q, and in its other filings with the Securities and Exchange Commission.

Contacts
Streamex Press & Investor Relations
Laura Kiernan
Head of Investor Relations
IR@streamex.com | laura@streamex.com

Henry McPhie
Chief Executive Officer, Streamex Corp.
www.streamex.com | X.com/streamex


SOURCE: Streamex Corp.

DISCLAIMER: BERNAMA MREM are not accountable for any causes of website defacement, misuse, or illegal activities connected to cryptocurrency, blockchain, tokenisation, or bitcoin. This material should not be considered as guidance or an opinion, as it does not constitute financial or investment advice. Use this information at your own risk; we are not liable for any losses or damages caused by the republication of this article.

ERS ELECTRONIC UNVEILS AUTOMATED PANEL-LEVEL PACKAGING SYSTEM

KUALA LUMPUR, Oct 1 (Bernama) -- ERS electronic, a provider of thermal management solutions for semiconductor manufacturing, has introduced a fully automated panel-level packaging (PLP) system for 310×310 mm substrates, integrating temporary carrier bonding, debonding and detaping on a single platform.

“Our new machine reflects our commitment to solving real manufacturing challenges,” said ERS electronic chief executive officer, Laurent Giai-Miniet in a statement.

He added that integrating three traditionally separate process steps into one automated platform enables customers to streamline production, improve process consistency and achieve higher yield and throughput.

The system operates at 13 panels per hour and eliminates inter-tool transfers across three thermally critical process steps. The first unit has been delivered to a leading semiconductor manufacturer for integration into its panel production line.

Developed and manufactured at ERS electronic’s Advanced Packaging facility in Barbing, Germany, the machine combines the company’s 55 years of thermal management expertise with more than 30 years of in-house machine-building capability, following ERS's 2024 integration of a semiconductor specialist equipment engineering team.

ERS has been an early adopter of panel-level packaging, having shipped its first commercial panel-level tool to Fraunhofer IZM in Berlin in 2018. The 310×310 mm panel format is gaining traction because it offers significantly greater substrate area utilisation compared with 300 mm circular wafers.

According to Yole Group, the panel-level packaging market is projected to grow at a compound annual growth rate of more than 40 per cent over the next five years. Dual-carrier bonding and debonding workflows are also becoming increasingly important for backside processing in 3D IC, high-bandwidth memory (HBM) and 2.5D IC packaging.

In dual-carrier processes, bonding and debonding typically require separate machines positioned at different points on the fab floor. Moving panels between tools adds handling steps and transit time while increasing the risk of substrate damage.

ERS said its integrated platform consolidates all three process steps within one system, allowing panels to move between process modules rather than between machines, reducing handling time and risk without requiring changes to the surrounding fab layout.

-- BERNAMA

YYFORCE SUBSIDIARY WINS SG$15.96 MLN FACILITY SERVICES CONTRACTS IN SINGAPORE

 

KUALA LUMPUR, Sept 30 (Bernama) -- YYForce Inc (YYForce) announced that its Singapore subsidiary, Hong Ye Group Pte Ltd (Hong Ye Group), has been awarded multiple new commercial cleaning and related facility services contracts in Singapore with an aggregate contract value of approximately SG$15.96 million, or around US$12.5 million. (US$1 = RM4.07)

YYForce Chief Executive Officer, Mike Fu said the new multi-year contract awards expand the company’s commercial services business in Singapore and strengthen Hong Ye Group’s contracted business visibility ahead of the October commencement.

The company in a statement said the newly awarded contracts cover multiple properties in Singapore and are scheduled to commence across October 2026, with varying service periods and principal contracts extending for approximately three years.

Based on current contractual schedules, aggregate contract values are expected to be approximately SG$5.57 million in the first year, SG$5.55 million in the second year and SG$4.84 million in the third year.

In the first half of 2026, YYForce’s integrated facility management (IFM) revenue increased 11.1 per cent year over year to approximately US$16.06 million, supported by new contract wins, renewals of existing projects and full-period contributions from subsidiaries acquired in 2025.

The new awards expand Hong Ye Group’s portfolio of contracted commercial cleaning and facility services work in Singapore and provide YYForce with additional multi-year contracted business visibility, following its recently reported first-half 2026 results.

Hong Ye Group is an important component of YYForce’s IFM operations in Singapore, with the company’s strategy focused on combining established frontline facility services with technology-enabled workforce management and, over time, increasing levels of artificial intelligence (AI), automation and robotics.

YYForce said it believes this model can support improved workforce deployment, service consistency, operating efficiency and scalability.

The newly awarded contracts provide an expanded operating base through which the company can continue developing and deploying technology-enabled solutions within its facility services operations.

-- BERNAMA