With Over 4000 Tool
Connections, the Industry-Leading ALPS™ Traceability Solution Tackles
Disaggregated Supply Chain Management Traceability Issues Through
Assembly and Packaging
SAN JOSE, Calif., July 12 (Bernama-GLOBE NEWSWIRE) -- PDF Solutions® Inc.
(NASDAQ:PDFS), the leading provider of yield improvement technologies
and services for the integrated circuit (IC) value chain, announced
today it has completed a transaction with Realtime Performance B.V.
(doing business as Kinesys Software), a Dutch provider of automation
software to the semiconductor industry, to acquire certain assets,
including both the ALPS and GEMbox™ software and certain customer and
OEM contracts, from the company.
The ALPS (Assembly Line
Production Supervisor) software is designed to enable complete
manufacturing traceability, including individual devices and substrates,
through the entire assembly and packaging processes; where the accurate
link between precise, original location on a silicon wafer and final
device can otherwise be weakened or lost. Assembly processes are
becoming increasingly complex and important to final device performance;
with the emergence and rapid growth of Wafer-Level Packaging (WLP),
2.5-D and 3-D processes (estimated by Yolé Development at 36% CAGR for
Fan-Out WLP and 28% CAGR for 2.5D/3D between 2017 and 2022).
ALPS, in conjunction with PDF Solutions’ Exensio®
big data analytics platform, is designed to provide device
manufacturers the capability to link final device performance, both at
test and in the field, to the totality of device fabrication and
characterization data, including data from PDF Solutions’
Characterization Vehicle® (CV®) electrical test
chip infrastructure. The ability to trace the manufacturing of products
from design, through bare silicon wafer, device on wafer, device on
strips, to the individual, final electronic device – whether or not the
device is equipped with an Electronic Chip ID (ECID) – is critical to
improving and maintaining quality; understanding the source of errors in
manufacturing and engineering the prevention of such errors in the
future. With its Exensio –Control product, PDF Solutions has the highest
market share of Fault-detection and Classification (FDC) software in
front-end foundry manufacturing (over 21,000 tool connections). It is
now seeing increasingly sophisticated process control, including the
deployment of FDC, in semiconductor assembly operations. This level of
comprehensive data collection and analysis, with full unit traceability,
is essential in order to both manage and maintain quality in the
increasingly demanding and competitive electronics markets for
automotive, medical devices and the internet-of-things (IoT).
“With
this critical link, we now intend to associate precisely the final
device performance with all of the data captured in the device’s
manufacture from wafer fab, through wafer test, assembly, final test and
burn-in within the Exensio database,” said Said Akar, General Manager
of the Volume Manufacturing Solutions business at PDF Solutions. “With
the massive increase in mission-critical electronics systems in all
aspects of our lives, the need for manufacturers to be able to provide
as-specified final device performance in a cost effective fashion
requires a comprehensive data infrastructure to be deployed across the
entire value chain. PDF Solutions intends to design the integrated
Exensio ALPS solution to provide that unbroken data story for each of
the billions of devices produced annually.”
ALPS is available from PDF Solutions immediately for evaluation, license and deployment. For more information, contact info@pdf.com.
FORWARD-LOOKING STATEMENTS
The
statements made in this press release regarding the Company's future
expected business performance and financial results are forward looking
and are subject to events and circumstances of the future. Actual
results could differ materially from those expressed in these
forward-looking statements. Risks and uncertainties that could cause
results to differ materially include risks associated with: continued
adoption of the Company's solutions by new and existing customers;
project milestones or delays and performance criteria achieved; the
integration of acquired technology; the provision of technology and
services prior to the execution of a final contract; and other risks set
forth in PDF Solutions' periodic public filings with the Securities and
Exchange Commission, including, without limitation, its Annual Reports
on Form 10-K, most recently filed for the year ended December 31, 2016,
Quarterly Reports on Form 10-Q, and Current Reports on Form 8-K and
amendments to such reports. The forward-looking statements made in the
conference call are made as of the date hereof, and PDF Solutions does
not assume any obligation to update such statements nor the reasons why
actual results could differ materially from those projected in such
statements.
ABOUT PDF SOLUTIONS
PDF
Solutions enables customers to reduce the time to market of integrated
circuits (“ICs”), lower the cost of IC design and manufacturing and
improve profitability. The Company has developed proprietary products
and provides services that target the entire Process Life Cycle, which
is a term used to mean the time from technology development and the
design of an IC to volume manufacturing of that IC to product assembly
and test. PDF Solutions’ products and services consist of proprietary
test structures and electrical test systems, physical intellectual
property, enterprise platform software and professional services. The
Company’s Characterization Vehicle®(CV®)
electrical test chip infrastructure provides core modeling capabilities,
and is used by more leading manufacturers than any other test chips in
the industry. The Design-for-Inspection™ solution extends the
Company’s electrical characterization technologies into the e-beam
measurement of extremely dense test structures, or DFI™ cells, across an entire fabrication process. Proprietary Template™ layout
patterns for standard cell libraries optimize area, performance, and
manufacturability for designing IC products. The Exensio® platform
for big data unlocks relevant, actionable information buried in wafer
fabrication, process control and test data through four, key components:
Exensio® –Yield, Exensio® –Control, Exensio® –Test, Exensio® –ALPS and Exensio® –Char. The Exensio platform is available either on-premise or via software as a service (SaaS).
Headquartered
in San Jose, Calif., PDF Solutions operates worldwide with additional
offices in Canada, China, France, Germany, Italy, Japan, Korea, and
Taiwan. PDF Solutions is listed on The NASDAQ National Market under the
ticker symbol PDFS. For the Company’s latest news and information, visit
http://www.pdf.com/.
Characterization
Vehicle, CV, Exensio, PDF Solutions, and the PDF Solutions logo are
registered trademarks of PDF Solutions, Inc. or its subsidiaries. ALPS,
Design-for-Inspection, DFI, and Template are trademarks of PDF
Solutions, Inc. or its subsidiaries.
Company Contacts:
Gregory Walker
VP, Finance and CFO
Tel: (408) 938-6457
Email:gregory.walker@pdf.com
Nicholas Ward
Senior Director of Marketing
Tel: (408) 283-5625
Email: nicholas.ward@pdf.com
SOURCE : PDF Solutions, Inc.
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