TOKYO, Sept 21 (Bernama-BUSINESS WIRE) -- Toshiba Corporation’s (TOKYO: 6502) Storage & Electronic Devices Solutions Company today announced the addition of two new products to its line-up of photorelays for use in measuring equipment, security systems and other applications. The photorelays have 4-pin SO6 packages that can operate at a maximum temperature of 110 degrees Celsius. The new photorelays are halogen-free[1] with a double mold structure guaranteeing isolation voltage of up to 3750 Vrms. Shipments start from today.
“TLP172AM” and “TLP172GM” utilize multi-chip technology and were developed as high spec, pin-compatible versions of Toshiba existing 2.54SOP package products, “TLP172A” and “TLP172G”. A double-mold structure improves minimum voltage isolation to 3750 Vrms against the 1500 Vrms of the current products.
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