SAN DIEGO & TOKYO, Jan 13 (Bernama) -- Qualcomm Incorporated
(NASDAQ:QCOM) and TDK Corporation (TOKYO:6762) today announced an
agreement to form a joint venture to enable delivery of RF front-end
(RFFE) modules and RF filters into fully integrated systems for mobile
devices and fast-growing business segments, such as Internet of Things
(IoT), drones, robotics, automotive applications and more, under the
name RF360 Holdings Singapore PTE. Ltd. (RF360 Holdings)[1]. The joint
venture will draw upon TDK's capabilities in micro-acoustic RF
filtering, packaging and module integration technologies and
Qualcomm's[2] expertise in advanced wireless technologies to serve
customers with leading-edge RF solutions into fully integrated systems.
http://www.bernama.com/bernama/v8/newsindex.php?id=1206642
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